It is used between high-power components and heat sinks, greatly reducing the interface thermal resistance of the device, effectively reducing the temperature of the heating device, and increasing the reliability of the power device.

【Product Features】

Thermal resistance as low as 0.05 °C-cm2/W

Silicone systems

Compresses to very small gaps

【Typical Application】

CPU, GPU, data module, zero-gap design

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