It is used between high-power components and heat sinks, greatly reducing the interface thermal resistance of the device, effectively reducing the temperature of the heating device, and increasing the reliability of the power device.

【Product Features】

2.0 – 12.0 W/m·K thermal conductivity

Silicone systems

Low oil permeability

Low compressive stress

High reliability

【Typical Application】

chip

base station

Document：None