Project, specifications, conductive adhesive thickness, release film thickness, length, width, storage conditions, expiration date, electrical characteristics, connection resistance, electromagnetic shielding, 90° peel strength, steel sheet, solder heat resistance, lead-free tin furnace 288 °C× 10sec, overflow volume, characteristics, test standards, no delamination bubbles
Project | Specifications |
Thickness of conductive adhesive | 60±10%μm |
Release film thickness | 50±10%μm |
length | 50~200±1m |
width | 250±1mm,520±1mm |
Storage conditions | Refrigerated storage（<10℃），RH<70% |
Term of validity | 3 months after manufacture |
project | characteristic | Test standards | |
Electrical characteristics | Connection resistance | <1.0Ω | Sunliky-Spec. |
Electromagnetic shielding | ≥55dB | ASTM-4935 | |
90 ° peel strength | Steel sheet | ≥10 N/cm | IPC-TM-650 2.4.9 |
Solder heat resistance | Lead free soldering288℃×10sec | No stratified bubble | IPC-TM-6502.4.13 |
Overflow amount | ≤0.15mm | IPC-TM-6502.4.17.1 | |
【Product Highlights】
1. High small hole conductivity (minimum filling pore diameter 0.3mm)
2. Good storage (15~20 days of refrigerated storage of fake stickers)
Press-fit conditions: 180°C, 10MPa, 120s; After curing at 160°C for 1.5h; the sample undergoes 288°C, 10s*3 times reflow soldering
Document：None