Products application
Thermal Potting(encapsulant silicone)
Product features
High thermal conductivity, fast curing
Good leveling
Excellent weather resistance
Insulating, soft, shock-resistant, waterproof
Low surface energy, easy to penetrate into coil gaps
Easy to repair
Performance parameters
The TGF200 of the TGF series can be used in control units, DC/AC inverters, on-board chargers, etc. in automobiles.
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Performance parameters
The TGF200 of the TGF series can be used in control units, DC/AC inverters, on-board chargers, etc. in automobiles.
Performance | TGF200 |
Thermal conductivity | ≥2.0 W/mK |
Hardness (Shore A) | 50 |
viscosity | <8000 mPas |
Operating temperature | -40~200℃ |
Dielectric strength | ＞20 KV/mm |
Volume resistivity | 1.0 E13 Ω.cm |
Material type | Silicones |